| Part Number | Description |
|---|---|
| 201202 | Unpopulated |
| 201202-110-43-308-41-001000 | Populated with Mill-Max MPN 110-43-308-41-001000 socket |
| 201202-[MPN] | Populated with component [MPN] |
Specifications:
- Maps each pin from the DIP-8 component to the equivalent pin at the header.
- Land pattern for DIP-8 component are through-holes on standard 0.1 in. pin pitch, rows spaced at 0.3 in.
- Diameter of plated through-holes is 0.035 in.
- Header footprint is SOIC-8 (0.050 in. = 1.27mm pin pitch).
- Board dimensions: 400 mil width, by 500 mil height
- Overall height (from flange of header to top of board): 0.61 in.
- Tg 130, FR-4 laminate
- ENIG surface finish
- Low loss traces: 20 mil minimum trace width
- Made in USA of domestic and foreign components.
- Supersedes part number 031101B.
- Download schematic.
